| PART |
Description |
Maker |
| LCM-S01602DSF-C LCM-S01602DSFC |
16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE
16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE BACKLIGHT, 1/16 DUTY, 1/5 BIAS.
|
LUMEX INC.
|
| FPM-8192V-R1AE FPM-8192V-X0AE |
19 SXGA Transflective Marine Grade Monitor with Resistive Touchscreen
|
Advantech Co., Ltd.
|
| BF128128E |
FSTN Transflective LCD, COF package Built-in driver HD66750
|
Bolymin, Inc
|
| RCM2060M A5800179 |
16 characters x 2 lines transflective character module with LED backlight
From old datasheet system
|
ROHM
|
| LCM-S01602DSF-B-Y |
5.56mm CHARACTER HEIGHT
|
LUMEX INC.
|
| DMF-50202NY-LY |
128 x 64dots; 0.40 x 0.56mm; 0.3-7.0V 1.0mA LCD module
|
Optrex Corporation
|
| 1-2013620-3 |
PGA Sockets; SOCKET ASSY W/EMBOSS TAPE 56mm, rPGA988A ( Tyco Electronics )
|
Tyco Electronics
|
| BZ-2RW8244-A2 |
SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.5A, 125VDC, 5.56mm, PANEL MOUNT
|
HONEYWELL SENSING AND CONTROL
|
| 44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
| 44067-0401 0440670401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| 44067-1602 0440671602 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
|
